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Industrial CT Scanner
Micro CT Scanner
Micro focus X-ray inspection system
Compact X-ray inspection system
In-line/Off-line X-ray inspection system
High speed X-ray fluoroscopic system
Crystal orientation measuring device
spacerNano Focus X-ray Inspection System
spacer(TX Lamino)
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Crystal Orientation Measuring Unit
SU Series
 
Toshiba original angle-measurement system with high precision
su

 

   
Applied Area
  - Crystal face orientation measurement for Orientation Flat or V-notch
  - Axis orientation measurement for Ingot
   
Applied Material
  Single crystal (Si, Sapphire, GaP, InP, InSb, SiC, GaN etc.)
   
Functions and Features

High precision angle-measurement system

Long-lasting and stable performance with tough mechanics

Original X-ray profile peak detection

Fast and high precision measurement
  
Patent Application Publication No.11-64252 (patent pending)

Original X-ray measuring system

TOSHIBA-made supersensitive detector

Long operating life

   
Lineups
   

Model

Objects

Application/Specification

SU-002

Ingot

 Axis orientation measurement
 Used before slicing up into Wafer with wire-saw.
 Accuracy :
    +/- 30 arcseconds
 Object size :
    2"
〜18"

SU-003

Wafer

 Flat/Notch position measurement
 Accuracy :
    +/- 30 arcseconds
 Object size :
    2"
〜 18"

SU-005

Ingot

 Axis orientation measurement,
 Flat/Notch position measurement
 Appearance check, figure and weight measurement,
 Crack, grinding tip check, etc.
 Accuracy :
   +/- 1 arcminutes(Axis orientation)
   +/- 3 arcminutes(Flat/Notch position)

SU-020

Ingot

 Axis orientation measurement,  
 Flat/Notch position measurement
 Accuracy :
   +/- 3 arcminutes(Axis orientation)
   +/- 3 arcminutes(Flat/Notch position)

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