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TOSMICRON-C3000 series

TOSMICRON-C series is compact, light weight and low cost series which are faithful to basic performance. There are two models. One is C3090IN equipped with micro focus X-ray and the other one is C3100IN equipped with mini focus X-ray.

TOSMICRON-C3090IN ( Micro focus type)

TOSMICRON-C3100IN (Mini focus type)

High performance system TOSMICRON-S series

TOSMICRON-C3090IN

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Features
  • Loaded with transmission type micro focus closed X-ray tube. High magnification, High resolution with high sensitivity X-ray I.I..
  • Standing job model is easy to use for production line.
  • Direct feeling and easy operation by hard panel.
  • Clear image by newly developed image processing software.
  • Wide opening door for ease of taking in/out of samples.
Example of usages
  • Inside of IC package:
     Chip die attach, Package voids, Bonding wire
  • Battery, Capacitor:
     Electrode structure
  • Packaged printed circuit board:
     Soldering inspection(BGA, CSP, Chips)
  • Ceramic, Plastic, Kinds of small part:
      Inspection of voids, crack , interior structure, etc.
  
TOSMICRON-C3090IN
TOSMICRON-C3090IN
Image example
Image example
Screen of image enhancing software
(X-ray image: 2nd bonding of IC)
Screen of image enhancing software
Specifications
Model TOSMICRON-C3090IN
Tube Voltage Range 40~90kV
Maximum Tube Current 30μA (Max. Anode Power consumption 2W)
Focal Spot Size 5μm (Nominal Value) : Micro Focus
X-ray Detector X-ray Image Intensifier 4”/2” dual
Display Magnification (On Table) About 200 times max.
Sample Table Effective area : 250×330mm
Inspecting Position Laser Marker
Outer Dimension W972.5×H1730×D1170mm
W700×H1730×D950mm(Main body)
Mass About 500kg

TOSMICRON-C3100IN

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Features
  • Standing job model is easy to use for production line.
  • Direct feeling and easy operation by hard panel.
  • Clear image by newly developed image processing software.
  • Wide opening door for ease of taking in/out of samples.
Example of usages
  • Small die-casting parts, Ceramics, kinds of small parts:
     Inspection of voids, crack, interior structure, etc.
  • Packaged printed circuit board:
     Soldering inspection(BGA, CSP, Chips)
  • Battery, Capacitor:
     Electrode structure
  • Inside of IC package:
     Chip die attach, Package voids, Bonding wire
  
TOSMICRON-C3100IN
TOSMICRON-C3100IN
Image example
Electrolytic capacitor Voids inside aluminum die-casting part
Electrolytic capacitor
Voids inside aluminum die-casting part
Specifications
Model TOSMICRON-C3100IN
Tube Voltage Range 40~100kV
Maximum Tube Current 0.83mA (Max. Anode Power consumption 50W)
Focal Spot Size 100μm (Nominal Value) : Mini Focus
X-ray Detector X-ray Image Intensifier 4”/2” dual
Display Magnification (On Table) About 22 times max.
Sample Table Effective area : 250×330mm
Inspecting Position Laser Marker
Outer Dimension W973×H1730×D1170mm
W700×H1730×D1170mm(Main body)
Mass About 500kg

Other optional items for TOSMICRON-C series

- 2 axes manipulator
- Tilting unit for PCB
- Various sample table (For heavy weight sample, Lifter table, For Soft X-ray)

  
Tilting unit for PCB
Tilting unit for PCB

(Can be used for inspection of large sample like PCB by tilting.)
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