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TOSHIBA IT & CONTROL SYSTEMS CORPORATION

X-Ray Nondestructive Inspection System

Micro-focus TXView

txview
Applications Chip mounted boards, electronic devices, small connectors, small automotive electronic parts, etc.

With the TXView micro-focus X-ray inspection system, you can analyze the internal conditions of small precision parts, electronic devices, and other components.

FEATURES

Micro-focus X-ray generator and a flat panel detector (FPD)

Select from 90-kV or 130-kV X-ray generators.
The 1.3-megapixel FPD provides clear images without distortion.

Functions for various types of analysis

The new TXView incorporates a proprietary high-dynamic-range (HDR) function to improve image quality and thus provides clearer images than the previous model.
The optional vertical CT unit makes 3D analysis possible.

Improved operability

The integrated camera for capturing the external appearance of an object makes it possible to operate the CT scanner while viewing a sample, enhancing operability.
The guided operation mode and improved software make it easy to capture clear images.

Ergonomic design

With its ergonomic design, the TXView is easy to use, regardless of whether you are sitting or standing.
As a result of improvements to the opening and angle of the sample door, the TXView now provides even better usability.

IMAGE EXAMPLES

MiniSD card

Capacitor

Broken cable

Aluminum die casting (cavities)

SPECIFICATION

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Key Specifications
Model TXV-S4130FD TXV-S4090FD
X-ray output 130kV / 300μA 90kV / 200μA
Minimum X-ray focal spot size 5μm
X-ray detector 1.3-megapixel flat panel detector (FPD)
Spatial resolution 5μm(JIMA RT RC-05)
On-monitor magnification ×160 (24-inch monitor) ×210 (24-inch monitor)
Maximum external dimensions of the sample table 410×360×80 mm
Maximum sample weight 2kg
TXV-S4090FD
X-ray output 90kV/200μA
Minimum X-ray focal spot size 5μm
X-ray detector 1.3-megapixel flat panel detector (FPD)
Spatial resolution 5μm(JIMA RT RC-05)
On-monitor magnification ×210 (24-inch monitor)
Maximum external dimensions of the sample table 410×360×80 mm
Maximum sample weight 2kg
Main unit external dimensions (W×D×H) 1150×1105×1725 mm
Main unit weight Approx. 950kg
Leakage dose 1 μSv/h or less
Power supply / ground Single-phase 100 VAC, 1.5 kVA / Earth resistance: 100 Ω or less
TXV-S4130FD
X-ray output 130kV/300μA
Minimum X-ray focal spot size 5μm
X-ray detector 1.3-megapixel flat panel detector (FPD)/td>
Spatial resolution 5μm(JIMA RT RC-05)
On-monitor magnification ×160 (24-inch monitor)
Maximum external dimensions of the sample table 410×360×80 mm
Maximum sample weight 2kg
Main unit external dimensions (W×D×H) 1150×1105×1725 mm
Main unit weight Approx. 1100 kg
Leakage dose 1 μSv/h or less
Power supply / ground Single-phase 100 VAC, 1.5 kVA / Earth resistance: 100 Ω or less
Image analysis and measurement functions
Measurement functions Wettability, wire sweep, point-to-point distance, BGA void calculation
Analysis functions Pseudo-color images, profiles, histograms, 3D rendering
Options
Vertical CT (cone beam CT) Vertical CT unit (attachable)
Two-axis rotating gear Rotating and tilting gear (attachable)

CASE EXAMPLE

Vertical CT (capacitor)

The following videos show the images of a capacitor using the optional vertical (cone beam) CT unit.
The cross-sectional images of a capacitor can be used to observe and analyze internal contaminants and flaws in 3D.

Capacitor (horizontal cross section)

Capacitor (vertical cross section)