X-Ray Nondestructive Inspection System
Compact Tilt Model: TXV-CH4090FD
|Applications||Chip mounted boards, BGAs, electronic parts, devices, sensors, resins, etc.|
The TXV-CH4090FD is an easy-to-use model for inspecting chip circuit boards.
Incorporating Toshiba’s X-ray sensing technology, the TXV-CH4090FD is ideal for inspecting solder on chip circuit boards and provides clear images of BGAs and soldering conditions.
The outstanding user interface simplifies and improves the efficiency of X-ray inspection.
Equipped with close tube with a maximum tube voltage of 90 kV and a minimum focal dimension of 5 μm.
Unlike the open tube, the closed tube is an easy-to-use device that does not require detailed maintenance.
FPD (Flat Panel Detector)
FPD has a wide dynamic range and can obtain fluoroscopic images that are not easily affected by halation.
In addition to the X, Y and Z-axis, the tilt axis enables fluoroscopic observation from an oblique direction.
The sample table moves in the X-Y axis direction, and the X-ray generator and X-ray sensor integrated mechanism move in the Z-axis and tilt axis, respectively.
Image Analysis, Image Measurement, Function of replay, Making movie file, Pitch Movement Function
Image Analysis: Pseudo Color, Profile, Histogram, 3D Image
Image Measurement: Die Attach Measuring (Includes Shading Function), Wire Sweep, 2 points Measurement, Measurement of void ratios, BGA void calculation
|Minimum X-ray focal spot size||5μm|
|X-ray detector||FPD (Flat Panel Detector)|
|On-monitor magnification||10～153 times|
|Sample table size||400×350mm|
|Maximum sample size||350(W)×400(D)×50(H)mm|
|Tilting degrees||0～60 degrees|
|Image measurement and analysis function|
|Image Measurement||Die Attach Measuring
Includes Shading Function Wire Sweep, 2 point s
Measurement, Measurement of void ratios , BGA void calculation
|Image Analysis||Pseudo Color, Profile, Histogram, 3D Image|
|2axis Sample Manipulator (Rotate/Tilt), Rotation table, External camera, Carbon work table|