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TOSHIBA IT & CONTROL SYSTEMS CORPORATION

SU Series

Crystal orientation measuring units

SU series

txlamino
Applications Measurement of crystal orientation of monocrystalline silicon ingots and wafers

The SU series supports silicon, sapphire, GaAs, GaP, InP, InSb, SiC, and other compounds. Incorporating a proprietary angle measurement system, the SU series can accurately measure the crystal orientation and external features and dimensions of monocrystalline ingots and wafers.

FEATURES

High-precision angle measurement

Toshiba’s proprietary angle measurement system provides repeatable and reproducible results and high linearity.

Long-term stability

The SU series’ mechanical subsystem with high strength and durability provides stable performance over the long term.

Proprietary X-ray peak profile detection

The SU series statistically detects X-ray peak profiles, delivering stable and precise angle measurement performance.

High-speed, high-precision measurement

In addition to four-direction measurement, the SU series supports two-direction measurement (except the SU-001), which roughly halves the measurement time.
For two-direction measurement of crystal orientation, the SU series uses spherical geometry to calculate the exact X and Y inclinations. This provides accuracy equal to four-direction measurement.

Proprietary X-ray measuring subsystem

The X-ray measuring subsystem uses a pulse height analyzer to reduce errors caused by scattering and other phenomena, thereby isolating the characteristic X-ray of copper for precise measurement.

High-sensitivity X-ray detector
(supporting the measurement of crystals with a large offset angle)

The X-ray detector exhibits outstanding sensitivity to the target X-ray (Kα of copper). This gas-filled X-ray detector features small variations in detection sensitivity irrespective of the position and direction of X-ray incidence. Therefore, it provides stable measurement regardless of changes in the inclination of the crystal face.

SPECIFICATION

Key Specifications
Model Object Measurement Applications
SU-001 Ingots V-notch (orientation flat face) orientation When attached to a cylindrical grinder for V-notch machining, the SU-001 determines the V-notch orientation.

·Accuracy: ±5 arcminutes
·Object size: 2 to 18 inches
SU-002 Ingots Cut face orientation (axial orientation) The SU-002 measures the axial orientation of ingots before they are sliced into wafers.

·Accuracy: ±30 arcseconds
·Object size: 2 to 18 inches
SU-003 Wafers V-notch (orientation flat face) orientation The SU-003 measures the orientations of the cut face (axial orientation) and V-notch and their inclinations relative to a given crystal face, and compares the results with reference values for pass/fail determination.

·Accuracy: ±30 arcseconds
·Object size: 2 to 18 inches
SU-005 Ingots V-notch (orientation flat face) orientation, appearance check, shape, weight The SU-005 measures the shape, depth, and crystal orientation of ingots after V-notch machining. It also measures chips, scratches, and grinding residuals, as well as the diameter and weight of ingots.

·Accuracy: ±5 arcminutes
SU-021 Ingots V-notch (orientation flat face) orientation The SU-021 measures the orientation of the cut face (axial) and the crystal orientation of the V-notch on ingots simultaneously before they are sliced into wafers. (The axial orientation is determined only through measurements of the lateral sides of an ingot (patent no. 3805869).)

·Accuracy: ±5 arcminutes (cut face); ±3 arcminutes (V-notch orientation)
SU-001
Object Ingots
Measurement V-notch (orientation flat face) orientation
Applications When attached to a cylindrical grinder for V-notch machining, the SU-001 determines the V-notch orientation.

·Accuracy: ±5 arcminutes
·Object size: 2 to 18 inches
SU-002
Object Ingots
Measurement Cut face orientation (axial orientation)
Applications The SU-002 measures the axial orientation of ingots before they are sliced into wafers.
·Accuracy: ±30 arcseconds
·Object size: 2 to 18 inches
SU-003
Object Wafers
Measurement V-notch (orientation flat face) orientation
Applications The SU-003 measures the orientations of the cut face (axial orientation) and V-notch and their inclinations relative to a given crystal face, and compares the results with reference values for pass/fail determination.
·Accuracy: ±30 arcseconds
·Object size: 2 to 18 inches
SU-005
Object Ingots
Measurement V-notch (orientation flat face) orientation, appearance check, shape, weight
Applications The SU-005 measures the shape, depth, and crystal orientation of ingots after V-notch machining. It also measures chips, scratches, and grinding residuals, as well as the diameter and weight of ingots.
·Accuracy: ±5 arcminutes
SU-021
Object Ingots
Measurement V-notch (orientation flat face) orientation
Applications The SU-021 measures the orientation of the cut face (axial) and the crystal orientation of the V-notch on ingots simultaneously before they are sliced into wafers. (The axial orientation is determined only through measurements of the lateral sides of an ingot (patent no. 3805869).)
·Accuracy: ±5 arcminutes (cut face); ±3 arcminutes (V-notch orientation)