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Contract Inspection Service
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Types, Inspection Ranges and Inspection Examples of Inspection Systems
Test Type
Test System
Maximum Testable Penetration Thickness in mm
Maximum Resolution
Application Examples
Iron
Aluminum
Plastic, Rubber, Wood
Fluoroscopy test
Micro Focus
.
 3
.
 50
.
 100
2m
Electronic components, BGAs
Mini Focus
.
 6
.
 100
.
 200
50m
Aluminum castings
Normal Focus
.
 20
.
 120
.
 250
250m
Aluminum castings
CT Scanner
Micro Focus
.
 6
.
 100
.
 200
5m
Moldings
Normal Focus
100
300
500
200m
Iron and aluminum castings

Necessary results of inspection data can be saved on CD-R/MO by versatile image processing functions


Aluminum Die Casting
3D Display by Reverse Engineering

Cell Phone Case

3D Display by Reverse Engineering
BGA

CT Cross-sectional Image
BGA

X-ray Fluoroscopic Image
  X-ray Fluoroscopy Test Service

Expert engineers on hand to adjust to optimum images

TOSMICRON Series
Packaged PCB BGAs and CSPs: Separation, cracks, voids, bridges
ICs: Wire and chip die attach, fluoroscopy of internal structures of electronic components
Small Aluminum Parts: Fluoroscopy of cavities, cracks and other defects. Fluoroscopy of electrodes inside batteries
Maximum Resolution: 2m
Maximum Penetration Thickness: Aluminum about 100mm
Enlarged Penetration of Fine Flaws: Maximum magnification 1,000 times or more
TOSRAY Series 3150 (150kV)
Iron and aluminum castings, plastics, rubber and glass products, wood, etc.: 150kV
Maximum Penetration Thickness: Aluminum about 120mm, iron 20mm
Automatic Decision and Evaluation Test and Consulting Services
Consulting service on quality control and manufacturing-line building also accepted.







  CT Scan Service

Industrial 400 kV CT
Highest X-ray Penetration Capacity and Accuracy
Objects maximum 600 mm in diameter and maximum 600 mm in height can be scanned.
High-precision cross-sectional images of objects of any material reconstructed(Aluminum castings, ceramics, plastics, etc.)
Conversion to a data format that can be read by CAD for 3D display and reverse engineering will also be feasible.
Micro CT
Micro CT with a 5m spatial resolution
High-resolution cross-sectional images of electronic components, batteries, cells, small aluminum castings and other objects can be obtained. Best suited for analysis of junctions of BGAs and CSPs.
Multi-slice, cone beam scanning and other versatile scanning modes available.
Conversion to a data format that can be read by CAD for 3D display and reverse engineering will also be feasible.




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